HTS Devices for Cellular Communications

The HTS device program involves the production of thallium based HTS material (in house), the microwave testing of such material and the manufacture of RF components for cellular base station applications. This also includes the integration of such devices in the target cryocooler system for operation at liquid nitrogen temperatures.

High Power Disk Combiners For DCS1800/UMTS

Power Combining For Cellular Base Stations

As the linearity requirements on systems increase and the avaiable spectrum decreases a need for devices that can combine many communication channels emerges. This is currently achieved using conventional copper cavities. These have the disadvantages of being large and bulky, and also of being lossy. The use of HTS materials enables a multi-carrier combiner to be impelemnted from 50mm diameter wafers. The devices exhibit less than 0.4dB insertion loss at the operational frequency of 1.8GHz

Network Analyser Measurements

TM011 Mode at 1.74GHz
Insertion loss 0.3-0.4dB (including connectors)
40MHz 3dB bandwidth
Tempaerature 60K Spectral Re-growth Measurements